Study of Electromigration and Thermomigration in Flip-Chip Solder Joints under Electron Flow Stressing
博士 === 國立中央大學 === 化學工程與材料工程研究所 === 94 === Abstract The flip chip technology has been the dominating packaging solution for high performance chips and will remain so in the foreseeable future due to its shorter electrical connection length between the chip and substrate. As the chip complexity increa...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/9d959a |