2-D Analytical Solution of Film Planarization for Spin Coating

• Main Authors: Jiann-Houng Lin, 林建宏
• Other Authors: Fu-Chu Chou
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/z4e8yt

碩士 === 國立中央大學 === 機械工程研究所 === 94 === This thesis is the first one to present “a 2-D analytical solution of film planarization for spin coating”. This analytical solution is used for predicting the degree of planarization (abbreviated as DOP), and describing the film distribution. Among semiconductor manufacturing process, utilizing spin coating can obtain the micro-thick film, and help other process to produce the elements. Thus, for the demand of design, quality, and productivity, understanding more about the mechanism of spin coating is required. This thesis can account more parameters than 1-D can. Hence, it won’t only describe the DOP of the very narrow feature, and the film profile. Due to the limit the symbolic computation application program, this thesis proposes an alternative approach for getting the DOP and film profile. The DOP is almost consistent with the former research, but inconsistent in film profile. We find that the square type feature is little of varied on arbitrary position. The DOP of the narrow rectangular feature will behave as that of longer rectangular one in lower angular position while its angular position becomes higher. On the contrast, when the longer rectangular feature raises its position, its DOP will be similar with that of the narrow rectangular one. This is because of the length of the distance across which the film flows. The DOP of the narrow feature is worse than that of the longer feature under the same condition of the ratio of centrifugal force to surface tension. This shows that the longer active length of surface tension can makes it more flatten. On certain position, the DOP becomes the same for various features. This means the angular position will effects the synthetic performance of the centrifugal force, wall effects, and surface tension, and make them the same. Those phenomena can help semiconductor industry for their pattern design and the arrangements, and resolve the problem of the miss alignment. To sum up, this thesis successfully illustrates the exploring of the feasibility of 2-D analytical solution. Moreover, it shows that there exists a mathematical physical approach to understand the mechanics of spin coating. Hence, offering a base for its relative applications.