The study of silicon/quartz wafer bonding technology
碩士 === 國立中央大學 === 機械工程研究所 === 94 === What makes the wafer bonding technology so attractive is that it can integrate various substrates into a novel material, but the difference in thermal expansion coefficient among different materials results in thermal stress, which makes the subsequent thinning p...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66005291930738500675 |