Aluminum Nitride Films for Surface Acoustic WaveDevice Applications

碩士 === 國立高雄第一科技大學 === 光電工程研究所 === 94 === Abstract This thesis focus on the growth the c-axis preferred orientation (002) oriented of aluminum nitride (AlN) thin film on Si(100) wafer using DC-reactive magnetron sputtering. We use the Al metal target (99.999% purity) at the in-line sputtering system...

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Main Authors: Feng-Kun Cheng, 鄭豐昆
Other Authors: Fu-Der Lai
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/93980713541239707087
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spelling ndltd-TW-094NKIT51240072016-05-20T04:18:01Z http://ndltd.ncl.edu.tw/handle/93980713541239707087 Aluminum Nitride Films for Surface Acoustic WaveDevice Applications 氮化鋁薄膜於表面聲波元件之應用 Feng-Kun Cheng 鄭豐昆 碩士 國立高雄第一科技大學 光電工程研究所 94 Abstract This thesis focus on the growth the c-axis preferred orientation (002) oriented of aluminum nitride (AlN) thin film on Si(100) wafer using DC-reactive magnetron sputtering. We use the Al metal target (99.999% purity) at the in-line sputtering system and adopt a high-purity Ar and N2 as the reaction gas. The experimental parameters are the target to substrate distance is 3cm, Sputtering pressure is 2 mTorr, the N2 contamination is 50%, the sputtering current was varied in the range from 3.5 to 4.5A, and the deposition time is 60 min. The target surface accumulate the nitrides and will decrease the deposition ration of AlN and increase the X-ray diffraction intensity of (002) orientation of AlN because the DC-reactive magnetron sputtering to deposit the AlN was used. The experimental results shows that the different grains orientation of AlN observe by X-ray diffraction (XRD) analysis when at the same deposition parameters of current. Surface acoustic wave (SAW) devices is patterned by lift-off process which is used the near field phase shift photolithography (NFPSL) to fabricate the narrow gap of a period space of IDT. The feature of process are: the narrow gap of IDT is about 180nm, the light source (I-line, λ=365nm) is adopted, the phase shifting mask (PSM) is patterned on the PDMS and the mask is consist of 10μm and 5μm. SAW devices with a high propagation velocity material (AlN) and a period space of IDT (180nm) are adopted. Based on the theoretical, the substrate of AlN(002)/Si(100) can be used to develop the higher harmonic frequency. But maybe due to the oxygen contamination of AlN, which decreased the electromechanical coupling factor. Therefore, we couldn’t effective excite the SAW perturbation on the substrate. Fu-Der Lai 賴富德 2006 學位論文 ; thesis 89 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立高雄第一科技大學 === 光電工程研究所 === 94 === Abstract This thesis focus on the growth the c-axis preferred orientation (002) oriented of aluminum nitride (AlN) thin film on Si(100) wafer using DC-reactive magnetron sputtering. We use the Al metal target (99.999% purity) at the in-line sputtering system and adopt a high-purity Ar and N2 as the reaction gas. The experimental parameters are the target to substrate distance is 3cm, Sputtering pressure is 2 mTorr, the N2 contamination is 50%, the sputtering current was varied in the range from 3.5 to 4.5A, and the deposition time is 60 min. The target surface accumulate the nitrides and will decrease the deposition ration of AlN and increase the X-ray diffraction intensity of (002) orientation of AlN because the DC-reactive magnetron sputtering to deposit the AlN was used. The experimental results shows that the different grains orientation of AlN observe by X-ray diffraction (XRD) analysis when at the same deposition parameters of current. Surface acoustic wave (SAW) devices is patterned by lift-off process which is used the near field phase shift photolithography (NFPSL) to fabricate the narrow gap of a period space of IDT. The feature of process are: the narrow gap of IDT is about 180nm, the light source (I-line, λ=365nm) is adopted, the phase shifting mask (PSM) is patterned on the PDMS and the mask is consist of 10μm and 5μm. SAW devices with a high propagation velocity material (AlN) and a period space of IDT (180nm) are adopted. Based on the theoretical, the substrate of AlN(002)/Si(100) can be used to develop the higher harmonic frequency. But maybe due to the oxygen contamination of AlN, which decreased the electromechanical coupling factor. Therefore, we couldn’t effective excite the SAW perturbation on the substrate.
author2 Fu-Der Lai
author_facet Fu-Der Lai
Feng-Kun Cheng
鄭豐昆
author Feng-Kun Cheng
鄭豐昆
spellingShingle Feng-Kun Cheng
鄭豐昆
Aluminum Nitride Films for Surface Acoustic WaveDevice Applications
author_sort Feng-Kun Cheng
title Aluminum Nitride Films for Surface Acoustic WaveDevice Applications
title_short Aluminum Nitride Films for Surface Acoustic WaveDevice Applications
title_full Aluminum Nitride Films for Surface Acoustic WaveDevice Applications
title_fullStr Aluminum Nitride Films for Surface Acoustic WaveDevice Applications
title_full_unstemmed Aluminum Nitride Films for Surface Acoustic WaveDevice Applications
title_sort aluminum nitride films for surface acoustic wavedevice applications
publishDate 2006
url http://ndltd.ncl.edu.tw/handle/93980713541239707087
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