Studies on grinding characteristics of silicon wafer thinning process
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 94 === The usual way to remove the silicon layer is used by the solutions of HF and KOH to conduct the etching process, but those chemicals are dangerous for the humans. Therefore, this study proposes the method that uses the diamond millstone to reduce the thickne...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41096135035402637622 |