Study of cutting quality for TFT-LCD glass substrate
碩士 === 國立中山大學 === 機械與機電工程學系研究所 === 94 === This study is the method of using the mechanical type to cut the substrate of the glass , under the circumstances that the glass surface is cut directly, probably produced 10∼20% of the depth of crack that is the thickness of glass, and then pulled the glass...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/42664574883884876850 |