Investigation of Micro Electronic Devices Reliability Using Interfacial Crack Growth Prediction Methodology
博士 === 國立清華大學 === 動力機械工程學系 === 94 === As the technology of the semiconductor process continues its scale miniaturization and improvement of electronic device performances, next-generation IC chips with Cu/low-k stacked structures and adopting the fabrication of a damascene module are being developed...
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| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00310038802047366004 |