Analysis and measurement of an intra-chip or inter-chip global interconnect by using LTCC manufacturing process
碩士 === 國立臺灣大學 === 電子工程學研究所 === 94 === This thesis is based on the concept of the System in Package to solve the problem of transmission of intra-chip or inter-chip global interconnect by using the LTCC (low temperature co-fired ceramic) process. By using the multilayer structure of LTCC, the chip de...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/79239311393002542374 |