Study on Trench-Filling and Microstructure of Copper Damascene Process via Molecular Dynamics Simulation
博士 === 國立臺灣大學 === 機械工程學研究所 === 94 === The trench filling and microstructures of depositing copper atoms on the titanium and tantalum diffusion barrier layers in a damascene process have been studied using parallel molecular dynamics simulation with the embedded atom method (EAM) as interaction poten...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13109247951449274512 |