Study on Trench-Filling and Microstructure of Copper Damascene Process via Molecular Dynamics Simulation
博士 === 國立臺灣大學 === 機械工程學研究所 === 94 === The trench filling and microstructures of depositing copper atoms on the titanium and tantalum diffusion barrier layers in a damascene process have been studied using parallel molecular dynamics simulation with the embedded atom method (EAM) as interaction poten...
Main Authors: | Rong-Tai Hong, 洪榮泰 |
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Other Authors: | 黃美嬌 |
Format: | Others |
Language: | zh-TW |
Published: |
2006
|
Online Access: | http://ndltd.ncl.edu.tw/handle/13109247951449274512 |
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