Dissolution Behavior of Metals and Intermetallic Compounds in Lead-Free Solders.
碩士 === 國立臺灣科技大學 === 化學工程系 === 94 === Element Cu and Ag have been widely used for interconnection materials in electronic industries. Sn、Sn-3.0Ag-0.5Cu、Sn-58Bi and Sn-9Zn solders are most common lead-free solders. Dissolution behavior and kinetic of metallic substrates-Cu, Ag and the intermetallic co...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/994vvk |