Treatment of Chemical Mechanical Polishing Wastewater of Semiconductor Manufacturer
碩士 === 國立臺灣科技大學 === 化學工程系 === 94 === Chemical Mechanical Polishing (CMP) has emerged as a preferred and the only planarization technology that provides global planarization as IC size smaller than 250 nm and wafer size changes to 8 in and beyond. However, the CMP has a major drawback in that it cons...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/e42628 |