Study of the Mechanism Properties and Interfacial Reactions as Using Indium Layer for UBM in BGA
碩士 === 國立臺灣科技大學 === 材料科技研究所 === 94 === For the coming leadfree time, the Sn/37Pb soder, traditional solder, has been limited gradually. How to reduce the reflow-temperature is the most important issue in the leadfree-process. So this study try to use another method, Solid-Liquid Interdiffusion Bondi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/my454j |