Applying Rough Set Theory in EWMA Controller to Improve the Process of CMP
碩士 === 東海大學 === 工業工程與經營資訊學系 === 94 === Chemical mechanical polishing(CMP) is the only technique to achieve global flat. Its unique polishing nature widely uses in the wafer surface outline smoothly, is a quite important part in the semiconductor manufacturing process. Because statistical process c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50222662812611183225 |