Effect of stabilizing compounds on electroless copper deposition
碩士 === 國立臺北科技大學 === 化學工程所 === 94 === Recently copper has been used to replace Al metallization in Ultra Large Scale Integrated (ULSI) technology because of low resistivity and stress-induced voiding. Copper can be deposited by physical vapor deposition, thermal-induced reflow, chemical vapor deposit...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/sk93cq |