Reserch for the Shear Stress of Wafer Surface at the Chemical Mechanical Polishing
碩士 === 吳鳳技術學院 === 光機電暨材料研究所 === 95 === Chemical mechanical polishing (CMP) is a process used in the silicon wafer fabrication industry to achieve the planarity necessary for the photolithography requirements of multilevel interconnects. CMP has been used in the global planarization of wafer surfaces...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/93561962237426338925 |