A Study on Using Heuristic Algorithm to Find the Optimal Parameters for IC Wire Bounding Process
碩士 === 國立雲林科技大學 === 工業工程與管理研究所碩士班 === 94 === The wire bonding process is a key process in an IC chip-package industry. It is important to find the optimal parameters for the wire bonding process. In this study, the artificial neural networks (ANN) and the multi-objective genetic local search algorit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/45014034843608617600 |