Electrocoagulation and Settled Process of Chemical Mechanical Polishing Wastewater from Semiconductor Fabrication
博士 === 元智大學 === 化學工程與材料科學學系 === 94 === Treatment of Cu chemical mechanical polishing (CMP) wastewater from a semiconductor plant by electrocoagulation was investigated. The CMP wastewater, as obtained from a large semiconductor plant, was characterized by high suspended solids (SS) content, high tur...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73787875729842612446 |