Thermal Stress Analysis and Strain Energy Release Rate in a Multi-layer Beam
碩士 === 元智大學 === 機械工程學系 === 94 === Multi-layer structures are common in electronic package especially for the micro devices manufactured Via the semi-conductor processes or MEMS processes. As the multi-layer structures subject to uniform temperature change, the thermal stresses are induced due to the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05811773462538380020 |