Thermal Stress Analysis and Strain Energy Release Rate in a Multi-layer Beam
碩士 === 元智大學 === 機械工程學系 === 94 === Multi-layer structures are common in electronic package especially for the micro devices manufactured Via the semi-conductor processes or MEMS processes. As the multi-layer structures subject to uniform temperature change, the thermal stresses are induced due to the...
Main Authors: | Chin-Hsien Lin, 林志賢 |
---|---|
Other Authors: | 何旭川 |
Format: | Others |
Language: | zh-TW |
Published: |
2006
|
Online Access: | http://ndltd.ncl.edu.tw/handle/05811773462538380020 |
Similar Items
-
Strain Energy Release Rate in a multi-layer beam with intetrfacial crack
by: Wei-Bo Su, et al.
Published: (2003) -
Silica-Based and Borate-Based, Titania-Containing Bioactive Coatings Characterization: Critical Strain Energy Release Rate, Residual Stresses, Hardness, and Thermal Expansion
by: Omar Rodriguez, et al.
Published: (2016-12-01) -
DETERMINATION OF STRESS-STRAIN STATE OF A THREE-LAYER BEAM WITH APPLICATION OF CONTACT LAYER METHOD
by: Andreev Vladimir Igorevich, et al.
Published: (2016-04-01) -
Thermal and Stress Analysis in Multi-layer Heterogeneous Bodies
by: Lee, Sen-Sung, et al.
Published: (1998) -
Finite Element Estimates Of Strain Energy Release Rate Components At Interface Cracks
by: Venkatesha, K S
Published: (2012)