Numerical Analysis of the Flow Field in Flush-Type Electroplating Device and Micro-Channel
碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 95 === This study is to research the site of micro-channel in the flush-type electroplating reactor which cause the effects of the flow field of electrolyte in reaction region. To analyze the cavity of micro-channel for the uniformity of micro-electorplating laye...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/87310423044048380020 |