Numerical Analysis of the Flow Field in Flush-Type Electroplating Device and Micro-Channel

• Main Authors: Yang,Kun-Lin, 楊昆霖
• Other Authors: 丁大為
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/87310423044048380020

碩士 === 國防大學中正理工學院 === 兵器系統工程研究所 === 95 === This study is to research the site of micro-channel in the flush-type electroplating reactor which cause the effects of the flow field of electrolyte in reaction region. To analyze the cavity of micro-channel for the uniformity of micro-electorplating layer, and by numerical computing to compare with different radial position for micro-channel in reaction region of the flush-type electroplating reactor. Because the uniformity of micro-electorplating layer lead the quality in electroplating manufacture, and it is involved in the position of electroplating-pattern. To research the correlation of different radial position and the uniformity of the electroplating layer is the major aim for this research. First, by operating in different flowrate and the flow distributor in different cone-shape. Analyzing the uniformity of micro-electorplating layer is associated with the flow pattern of micro-channel under reaction region of electroplating device and the distributions of stain rate, and by limiting the flowrate of model to analyze the quality of different flowrate and different angle in distributor. Researching the uniformity of the strain rate in reaction region by simulating numerically in different radial position. From the results of computing in different radial position by limiting the condition of flowrate, the flow phenomena(the patterns of flow circulation), the tendency of the strain rate distribution and its quantified results (standard deviation value of strain rate, the average value of strain rate and dimensionless standard deviation value of strain rate) were then analyzed. The models of micro-channel with cavity can boost the thickness of micro-electorplating layer by enhancing strain rate. But, it is not uniform that the flowrate more growth, the standard deviation value of strain rate more increasing. Whereas, the standard deviation value of strain rate become lower led it is better uniformity when the models of micro-channel with cavity or the flat of electroplating-piece with no cavity in lower flowrate. Comparing with the position of center and outer in radial direction, discovering that he standard deviation value of strain rate is not uniform and variation large. Analyzing three important operation condition which including flowrate, radial position and the flow distributor. In same operation condition, the cone-shape flow distributor can improve emphatically the uniformity of reaction region in strain rate. As a result, the cone-shape flow distributor is important parameters which cause the uniformity of the electroplating layer.