Study on the Thermosonic Flip Chip Bonding of Chips with Copper Interconnect onto rigid and flex substrate
碩士 === 國立中正大學 === 機械工程所 === 95 === In this study, thermosonic bonding was applied to flip chip bonding of Cu chip to alumina substrate. The effect of flip chip bonding parameters and high temperature storage（HTS） on the shear strength was discussed. Investigation of bonding strength variation with d...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/71394271671884811093 |