Study for wedge bonding and wire bond ability of semiconductor packages
碩士 === 中華技術學院 === 機電光工程研究所碩士班 === 95 === Wire bonding is a critical process in electronic package and is responsible for electricity and signal delivery. Therefore, understanding the bonding process redound to the best design of operation parameters. It can increase yield and advance products reliab...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/72102378672176097503 |