The study of FCBGA package reliability with equivalent and sub-modeling methodology
碩士 === 中華大學 === 機械與航太工程研究所 === 95 === Due to the high speed and high I/O count for semiconductor package requirements, thousands of soldered interconnection are indispensable, and this situation renders the traditional finite element method (FEM) analysis a formidable challenge. This thesis presents...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53945951306527589348 |