The Effect of Dissolved Oxygen and Pulse Auxiliary Electric-Field on Electroless Copper Plating
碩士 === 朝陽科技大學 === 應用化學系碩士班 === 95 === In this study, effects of dissolved oxygen and pulsed electric current of different duty cycles in electroless copper plating have been investigated. In order to find out the dependence of microstructure and property of copper deposition on experimental paramete...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70291119159462480559 |