A Study of Theory of Constraints Applied on Production Planning of Turnkey in Semi-Conductor Packaging and Testing Companies

碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 95 === It changes fast and competes violently for Semiconductor these years, especially happens to Packaging and Testing business. In order to acquire more orders, many head testing and packaging companies provide turnkey services, including “Chip Probe”, “Assembly”...

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Bibliographic Details
Main Authors: Hsing-Chien Wu, 吳行健
Other Authors: Feng-tsueng Cheng
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/66373127815967359479