Fabrication of Interconnection Thin-Film Wiring Systems for Damascene Nanostructures--Application of Vacuum-Plasma Surface Modification Integrated with All-Electrochemical Deposition Process
碩士 === 逢甲大學 === 材料科學所 === 95 === The fabrication of thin film copper inter-connect line in traditional micron (＞100 nm) integrated circuits generation was involved in dry ionized sputtering barrier and the filling of pinholes and trenches by wet electrochemical deposition. This kind of dry/wet combi...
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| Format: | Others |
| Language: | zh-TW |
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2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/11501531480332569184 |