The Use of MTS in the Selection of Inspection Area for Solder Paste Printing
碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 96 === Surface Mount Technology(SMT) helps achieve miniaturation of end product and lower production cost in the electronics packaging and assembly. SMT includes the solder paste printing, chip mounting, and reflow soldering process. Amount of solder paste deposite...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00577058322130085155 |