The Use of MTS in the Selection of Inspection Area for Solder Paste Printing

• Main Authors: Meng-Hsin Liu, 劉孟鑫
• Other Authors: Chien-Yi Huang
• Format: Others
• Language: zh-TW
• Published: 2007
• Online Access: http://ndltd.ncl.edu.tw/handle/00577058322130085155

碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 96 === Surface Mount Technology(SMT) helps achieve miniaturation of end product and lower production cost in the electronics packaging and assembly. SMT includes the solder paste printing, chip mounting, and reflow soldering process. Amount of solder paste deposited during the printing process plays important role to the assembly yield. Therefore, the selection of locations to be inspected for solder volume/height is critical in the assembly process. This research applies Mahalanobis-Taguchi System (MTS) in determining solder joints for Solder Paste Inspection(SPI) after printing process. We evaluate the necessity of inspection from signal to noise ratio gain of all solder joints. The number of solder joint to be inspected can be reduced concurrently ensure desired the quality level. The Chebyshev’s theorem is then employed to forecast a probabilistic threshold to identify the printing failure. The result indicates that within a total of 203 solder joints, 121 solder joints are found to be critical and suggested for inspection based on the signal to noise ratio gain. The optimal scenario is with a reduction ratio of 40.4%. The reliability is confirmed and the probabilistic threshold is 5.046. This can be uses as a threshold for determining failure or pass in to printing process.