The Evaluation of Printed Circuit Board and Reliability Assessment for Lead Free Process
碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 95 === To cope with global environmental concerns and regulations, the lead free solder has been used in the Printed Circuit Board Assembly (PCBA) industry to replace the tin-lead (Sn63/Pb37) solder. A typical lead free material, Sn/Ag3%/Cu/0.5% (SAC305) has meltin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/69506469184398910508 |