A Study on the Interfacial Reaction and Reliability of BGA Sn-3.0Ag-0.5Cu Lead-Free Solder Joints
碩士 === 義守大學 === 材料科學與工程學系碩士班 === 95 === The current study aimed to explore the influence of the multi-reflow and high temperature storage on the shear and impact strengthes between Sn-3.0Ag-0.5Cu and Sn-63Pb solder balls and Cu/Ni/Au substrates by using the shear and impact tests. The interfacial re...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/02962247867453350987 |