Solder Joints Reactions Between Different BGA Substrate Metallised Surface And Pb-Free Solder
碩士 === 義守大學 === 材料科學與工程學系碩士班 === 95 === This research paper includes surface finish of BGA (Ball Grid Array) solder pads and the lead-free solder ball combine with solder joints uses in electronic package technology. Nowadays, BGA metal surface finish, is produced to regard electroplating the way as...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97626435957427053912 |