Effects of various molding parameters on warpage of an IC package.
碩士 === 義守大學 === 電子工程學系半導體暨封裝測試產業研發碩士 === 95 === Along with the semi-conductor the proportion that pack the usage ball grid array process is more important, and warpage problem to also be subjected to a value increasingly.But the former research , often making use of the computer simulation to predi...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/87141170993082555413 |