Dynamic Analysis for Microstructure of Cu/Low-K Wafer Subjected to Wire Bonding
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 95 === Innovation and progress that lasting with the technology of the semiconductor, electronic product with light and thin and short and small as direction day by day. Wafer design to get follow-up assembly processes become very important at this moment. This rese...
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/96714032253920371533 |