Interfacial reactions of eutectic SnZn solder on bulk and thin-film Cu substrates
碩士 === 國立中興大學 === 化學工程學系所 === 95 === SnPb olders have been used as the principal joining materials in electronic packaging due to many well-known advantages, like low cost, good wettability, and proper melting point. However, the usage of Pb in electronic products has a serious concern because the t...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43030205581132157311 |