Optimal Design of Fatigue Life for Quad Flat No Lead Package by Using Taguchi Method
碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === Since the quad flat no-lead package (QFN) is closed to Chip scale package with characters of fine pitch and small outline.It is facilitated to increase the utility rate of PCB and Compared to TSOP or QFP, QFN is in favor of 60% reduction in volume and less cost...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/43157119020245898943 |