Application of Endochronic Viscoplasticity with Cyclic Damage to Sn/3.5Ag/0.75Cu Solder Joint Specimens under Cyclic Proportional Displacement Path
碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === In order to find stress-strain-damage behavior of solder ball by using solder joint specimen, this thesis defined, at first, the stiffness of material testing system, whose value could be determined from the slope of linear range of loading or unloading of the...
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| Format: | Others |
| Language: | zh-TW |
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2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62006065891178527327 |