Effect of Mold Surface Cleaning Method on the Adhesion between EMC and Mold
碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === During the encapsulation process of IC packages, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between EMC and mold surface. Adhesion effects can cause many problems. However, an exce...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50573907703593530697 |