Effect of Mold Surface Cleaning Method on the Adhesion between EMC and Mold
碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === During the encapsulation process of IC packages, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between EMC and mold surface. Adhesion effects can cause many problems. However, an exce...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50573907703593530697 |
| Summary: | 碩士 === 國立成功大學 === 工程科學系碩博士班 === 95 === During the encapsulation process of IC packages, when epoxy molding compound (EMC) is filling the mold cavity and cured in the mold, adhesion effects occur in the interface between EMC and mold surface. Adhesion effects can cause many problems. However, an excessive adhesion force may damage an IC during ejection and cause the package to fail and decrease the yield rate and reliability.
This research uses a semi-automatic EMC adhesion force test instrument that had been developed and fabricated to measure normal and shear adhesion forces between the mold surface and EMC. The most effectiveness of mold coating is used to execute the continuous normal adhesion experiment. The variation of normal force during successive molding test could be used to predict the time for mold cleaning. By counting the total number of shots when the normal force begins to rise. Comparing various mold cleaning methods to find out the most efficient way, the duration of mold usage after mold cleaning could be extended.
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