Investigations on the Interfacial Reaction, Shear and Electrical Properties of Sn-Ag-Cu Solder Joints with Sn-Zn-Bi Paste Addition
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 95 === Among proposed lead-free solders, Sn-Ag-Cu ternary alloy has been regarded as the most potential candidate to replace the conventional Sn-Pb alloy. However, the eutectic melting point of Sn-Ag-Cu solder is notably higher (roughly 34oC) than that of Sn-Pb al...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98510766169877513901 |