A Study on the Solidification Microstructure and Thermo-physical Properties of Sn-8.5Zn-0.5Ag-0.1Ga-xAl Lead-Free Solder Alloys
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 95 === The solidification microstructure and the thermal physical properties of Sn-8.5Zn-0.5Ag-0.1Ga-xAl lead-free solder alloys, where x varies between 0.0 and 4.0 wt.%. A Computer Aided-Cooling Curve Analysis (CA-CCA) technique was used to determine the pasty ra...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/70350306721231076580 |