Studies on wetting behavior and interfacial reaction between Sn-8.Zn-xAg-0.01Al-0.1Ga lead-free solder alloys and Cu substrates
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 95 === Abstract Solder alloys are used to bond electronics devices. As the size of the solder joints becomes smaller and smaller, the mechanical properties and reliability of the solder alloys become extremely important. This bonding is the results in the diffus...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90875484634796470872 |