Application of Phase Shift and Optic Proximity Correction Technology for Single Mask Dual Damascene Process

碩士 === 國立成功大學 === 微電子工程研究所碩博士班 === 95 === Dual damascene process has been used for copper interconnect. There are many schemes to fabricate dual damascene structure. The most common integration approaches for the dual damascene architecture are via first, trench first and buried hard mask. Which mas...

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Bibliographic Details
Main Authors: Jia-Feng Fang, 方嘉鋒
Other Authors: Dung-Ching Perng
Format: Others
Language:en_US
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/87036721446850303863