Erosion defect measurement and modeling of the copper CMP
碩士 === 國立成功大學 === 電機工程學系碩博士班 === 95 === Chemical mechanical polishing (CMP) always accompany some defects – dishing and erosion. There are many papers talking about these two defects. However, for these two defects, there isn't a completed model to monitor them yet. Therefore, we will propose a...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/55717433513450470436 |