Study of Process-Induced Warpage and Paddle-Shift Phenomena in IC Packaging
博士 === 國立成功大學 === 機械工程學系碩博士班 === 95 === Warpage problems play an important role in IC encapsulation processes. Previous researchers had focused on warpage analyses with temperature changes between constituent materials and neglected the cure shrinkage effects. However, more and more studies indicate...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/24945476665771444778 |