Automatic Inspection System Design for Wire Bonding
博士 === 國立交通大學 === 工業工程與管理系所 === 95 === Wire bonding is the process that makes the connection between the IC chip and the substrate. The minimum diameter of a bonding wire, which appears as a 3D loop in an IC chip, is about 20 μm. This kind of bonding wire easily bends or sags in the middle segment....
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| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/58469863939722412446 |