Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===
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Online Access: | http://ndltd.ncl.edu.tw/handle/44429328041486977943 |
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ndltd-TW-095NCTU51590292015-10-13T13:59:36Z http://ndltd.ncl.edu.tw/handle/44429328041486977943 Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating 添加劑對電鍍銅填孔力之影響及利用無電鍍銅製作奈米銅層 羅世儒 碩士 國立交通大學 材料科學與工程系所 95 吳樸偉 2007 學位論文 ; thesis 59 zh-TW |
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zh-TW |
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Others
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碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===
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author2 |
吳樸偉 |
author_facet |
吳樸偉 羅世儒 |
author |
羅世儒 |
spellingShingle |
羅世儒 Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating |
author_sort |
羅世儒 |
title |
Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating |
title_short |
Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating |
title_full |
Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating |
title_fullStr |
Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating |
title_full_unstemmed |
Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating |
title_sort |
effects of additives on filling performance in copper electroplating and conformal copper deposition in high-aspect ratio trenches by electroless plating |
publishDate |
2007 |
url |
http://ndltd.ncl.edu.tw/handle/44429328041486977943 |
work_keys_str_mv |
AT luóshìrú effectsofadditivesonfillingperformanceincopperelectroplatingandconformalcopperdepositioninhighaspectratiotrenchesbyelectrolessplating AT luóshìrú tiānjiājìduìdiàndùtóngtiánkǒnglìzhīyǐngxiǎngjílìyòngwúdiàndùtóngzhìzuònàimǐtóngcéng |
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