Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating

Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating

碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===

Bibliographic Details
Main Author: 羅世儒
Other Authors: 吳樸偉
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/44429328041486977943
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spelling ndltd-TW-095NCTU51590292015-10-13T13:59:36Z http://ndltd.ncl.edu.tw/handle/44429328041486977943 Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating 添加劑對電鍍銅填孔力之影響及利用無電鍍銅製作奈米銅層 羅世儒 碩士 國立交通大學 材料科學與工程系所 95 吳樸偉 2007 學位論文 ; thesis 59 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立交通大學 === 材料科學與工程系所 === 95 ===
author2 吳樸偉
author_facet 吳樸偉
羅世儒
author 羅世儒
spellingShingle 羅世儒
Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
author_sort 羅世儒
title Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
title_short Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
title_full Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
title_fullStr Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
title_full_unstemmed Effects of Additives on Filling Performance in Copper Electroplating and Conformal Copper Deposition in High-Aspect Ratio Trenches by Electroless Plating
title_sort effects of additives on filling performance in copper electroplating and conformal copper deposition in high-aspect ratio trenches by electroless plating
publishDate 2007
url http://ndltd.ncl.edu.tw/handle/44429328041486977943
work_keys_str_mv AT luóshìrú effectsofadditivesonfillingperformanceincopperelectroplatingandconformalcopperdepositioninhighaspectratiotrenchesbyelectrolessplating
AT luóshìrú tiānjiājìduìdiàndùtóngtiánkǒnglìzhīyǐngxiǎngjílìyòngwúdiàndùtóngzhìzuònàimǐtóngcéng
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