Using Data Mining Technology to Construct a Quality Improvement System for Semiconductor Packaging Industry
博士 === 國立交通大學 === 資訊管理研究所 === 95 === Yield enhancements are always the key factor among competitors in the semiconductor packaging industry. In view of this, this paper attempts to construct a quality improvement system to increase process yield. Case study focuses mainly on the tape carrier package...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17031167157325375036 |