A Block and I/O Buffer Placement Methodology for Chip-Package Codesign
碩士 === 國立交通大學 === 電子工程系所 === 95 === As silicon technology scales, we can integrate more and more circuits on a single chip,which means more I/Os are needed in modern designs. The flip-chip packaging was developed by IBM in 1960's. It is better than the typical peripheral wire-bond design in the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/30565757918561807643 |